Di Liang is currently a research scientist at Hewlett Packard Labs. In 2007 - 2009, he was a research specialist in the Bowers group where he participated the early stage development of the hybrid III-V-on-Si platform. He developed high-quality and large-scale direct wafer bonding technology with vertical outgassing channels and hybrid low-threshold microring lasers. His current research interests include III-V and silicon integrated photonics, heterogeneous and monolithic material integration and nanofabrication technology. He has authored and coauthored over 148 journal and conference papers, five book chapters, and was granted by eight patents (each with multiple region filing) with another 40+ pending. He received his B.S. degree in Optical Engineering from the Zhejiang University, China, and Ph.D. degree in Electrical Engineering from the University of Notre Dame, USA. He is a senior member of IEEE and member of OSA.