Publications

Integration of 420 Optical Elements for a Multiterabit/s Network-on-Chip C. Zhang, S. Zhang, J. D. Peters, J. E. Bowers Micro-Optics ConferenceBerkeley, CA October 12, 2016 C1023.pdf26.88 KB
A Comparison of Widely Tunable, Narrow Linewidth Ring Cavity Lasers on Silicon Substrates J. E. Bowers, T. Komljenovic, S. Srinivasan, J. Hulme, and M. Davenport International Photonics Conference (IPC)Reston, VA October 4, 2016 C910.pdf438.77 KB
Ultra-low Loss Large Area Waveguide Coils for Integrated Optical Gyroscopes T. Huffman, M. Davenport, M. Belt, J. E. Bowers and D. J. Blumenthal IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C953.pdf580.78 KB
Hyperfine Magnitude Response Measurement for Optical Filters based on Low-frequency Detection S. Zhang, X. Zou, C. Zhang, H. Wang, Y. Zhang, Y. Liu, J. E. Bowers IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C959.pdf594.34 KB
GaN Based Cyan Light-Emitting Diodes with GHz Bandwidth J.-W. Shi, K.-L. Chi, J.-M. Wun, J.-E. Bowers, and J.-K. Sheu IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C1009.pdf1.21 MB
Integrated Photonics for MWP J. E. Bowers, T. Komljenovic, J. Hulme, M. Davenport, C. Zhang IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C1031.pdf316.3 KB
Refined procedure for gain measurement in Fabry-Perot semiconductor lasers N. Volet, E. J. Stanton, M. L. Davenport, A. Spott, L. Chang, and J. E. Bowers IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C954.pdf682.33 KB
A thin-film PPLN waveguide for second-harmonic generation at 2-µm L. Chang, N. Volet, Y. Li, J. Peters, and J. E. Bowers IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C1007.pdf547.27 KB
High-Speed and High-Power GaSb Based Photodiode for 2.5 μm Wavelength Operations C. Rui-Lin, J.-M. Wun, Y.-W. Wang, Y.-H. Chen, J. E. Bowers, and J.-W. Shi IEEE International Photonics ConferenceWaikoloa, Hawaii October 2, 2016 C960.pdf956.04 KB
Heterogeneous Photonic Integration by Direct Wafer Bonding M. L. Davenport, L. Chang, D. Huang, N. Volet, and J. E. Bowers Semiconductor Wafer Bonding SymposiumHonolulu HI October 2, 2016 C1010.pdf370.59 KB